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“martí boada”

Showing 1 - 12 of 12 results for “martí boada”
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  • Battery-less NFC Sensors for the Internet of Things

    by Martí Boada, Antonio Lazaro, David Girbau, Ramón Villarino ...
    The implementation of near-field communication (NFC) technology in smartphones has grown rapidly, especially due to the use of this technology as a payment system. In addition, the ability to use the energy transmitted not only for communication, but also for feeding other devices, which together with the low cost of NFC chips and the internet connectivity of the smartphones, allows the design of ... Read more

    $188.99 CAD

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  • Product Manufacturing and Cost Estimating using CAD/CAE

    The Computer Aided Engineering Design Series

    by Kuang-Hua Chang ...
    This is the second part of a four part series that covers discussion of computer design tools throughout the design process. Through this book, the reader will... - ...understand basic design principles and all digital design paradigms. - ...understand CAD/CAE/CAM tools available for various design related tasks. - ...understand how to put an integrated system together to conduct All Digital ... Read more

    $79.99 CAD

  • Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

    High Performance Compute and System-in-Package

    by Beth Keser, Steffen Krhnert ...
    Series series IEEE Press
    Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologiesIn Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches.The book begins with a market ... Read more

    $160.99 CAD

  • 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

    by Lih-Tyng Hwang, Tzyy-Sheng Jason Horng ...
    Series series IEEE Press
    An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessmentsFeatures an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobilityPresents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and MinitabFundamental design ... Read more

    $158.99 CAD

  • Electrical Connectors

    Design, Manufacture, Test, and Selection

    Edited by San Kyeong, Michael G. Pecht ...
    Series series IEEE Press
    Discover the foundations and nuances of electrical connectors in this comprehensive and insightful resourceElectrical Connectors: Design, Manufacture, Test, and Selection delivers a comprehensive discussion of electrical connectors, from the components and materials that comprise them to their classifications and underwater, power, and high-speed signal applications. Accomplished engineer and ... Read more

    $166.99 CAD

  • Fan-Out Wafer-Level Packaging

    by John H. Lau ...
    Series series Engineering (R0)
    This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, ... Read more

    $128.99 CAD

  • Co-operative and Energy Efficient Body Area and Wireless Sensor Networks for Healthcare Applications

    by Akram Alomainy, Raffaele Di Bari, Yifan Chen, Qammer H. Abbasi ...
    With the advances in small and low-cost radio transceivers and RF front-ends development, the possibility of applying ubiquitous and non-invasive sensors integrated into user's daily clothing and living activities seems more feasible. The ability to share data increases the usefulness of personal information devices, providing features not possible with independent isolated devices. Current ... Read more

    $39.99 CAD

  • A CMOS Self-Powered Front-End Architecture for Subcutaneous Event-Detector Devices

    Three-Electrodes Amperometric Biosensor Approach

    by Jordi Colomer-Farrarons, Pere MIRIBEL ...
    Series series Engineering (R0)
    A CMOS Self-Powered Front-End Architecture for Subcutaneous Event-Detector Devices presents the conception and prototype realization of a Self-Powered architecture for subcutaneous detector devices. The architecture is designed to work as a true/false (event detector) or threshold level alarm of some substances, ions, etc... that are detected through a three-electrodes amperometric BioSensor ... Read more

    $115.99 CAD

  • Enabling the Internet of Things

    From Integrated Circuits to Integrated Systems

    Edited by Massimo Alioto ...
    Series series Engineering (R0)
    This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system ... Read more

    $153.99 CAD

  • Microwave Bandpass Filters for Wideband Communications

    by Lei Zhu, Sheng Sun, Rui Li ...
    Series Book 232 - Wiley Series in Microwave and Optical Engineering
    This book will appeal to scientists and engineers who are concerned with the design of microwave wideband devices and systems. For advanced (ultra)-wideband wireless systems, the necessity and design methodology of wideband filters will be discussed with reference to the inherent limitation in fractional bandwidth of classical bandpass filters. Besides the detailed working principles, a large ... Read more

    $126.99 CAD

  • 3D Integration in VLSI Circuits

    Implementation Technologies and Applications

    Edited by Katsuyuki Sakuma ...
    Series series Devices, Circuits, and Systems
    Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are ... Read more

    $116.99 CAD

  • Bioelectronics and Medical Devices

    Applications and Technology

    Edited by Garima Srivastava, Manju Khari ...
    This new volume provides an abundance of information on new biomedical applications being used today. The book covers a wide range of concepts and technologies, discussing such modern technological methods as the Internet of Things, e-pills, biomedical sensors, support vector machines, wireless devices, image and signal processing in e-health, and machine learning. It also includes a discussion on ... Read more

    $247.99 CAD