Rakuten Kobo

Panier

Article(s) non disponible(s) à la vente

Veuillez vérifier votre panier. Vous pouvez supprimer le ou les articles qui ne sont pas disponibles maintenant ou nous les supprimerons automatiquement au moment du règlement de la commande.

articlesarticle

- Accès illimité aux eBooks
  
  Accès illimité aux livres audio
  
  Aucun engagement, annulez à tout moment à kobo.com/account/subscriptions
  
  Obtenez 1 crédit chaque mois pour le livre audio de votre choix
  
  Aucun engagement, annulez à tout moment à kobo.com/account/subscriptions
  
  Accès illimité aux eBooks
  
  Accès illimité aux livres audio
  
  Aucun engagement, annulez à tout moment à kobo.com/account/subscriptions
  Livre audio
  par ,
  
  Disponible:
  
  . Aucun engagement, annulez à tout moment à kobo.com/account/subscriptions.
  
  Précommander
  1 livre audio par mois
  
  + Essai GRATUIT de 30 jours
  
  Offre spéciale
  
  Obtenez 1 crédit chaque mois pour un livre audio de votre choix
  
  * Aucun engagement. Résiliez votre abonnement à tout moment.
  
  GRATUIT

articlesarticle

Accès illimité aux eBooks

Accès illimité aux livres audio

Aucun engagement, annulez à tout moment à kobo.com/account/subscriptions

Obtenez 1 crédit chaque mois pour le livre audio de votre choix

Aucun engagement, annulez à tout moment à kobo.com/account/subscriptions

Accès illimité aux eBooks

Accès illimité aux livres audio

Aucun engagement, annulez à tout moment à kobo.com/account/subscriptions
Livre audio
par ,

Disponible:
. Aucun engagement, annulez à tout moment à kobo.com/account/subscriptions.

Précommander
1 livre audio par mois

+ Essai GRATUIT de 30 jours

Offre spéciale

Obtenez 1 crédit chaque mois pour un livre audio de votre choix

* Aucun engagement. Résiliez votre abonnement à tout moment.

GRATUIT

Recommandé pour vous

Skip side bar filters

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

par Brandon Noia, Krishnendu Chakrabarty ...

Collections series Engineering (R0)
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, ... En savoir plus

$115.29 CAD

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits,
... En savoir plus

VLSI Interview Questions with Answers

par Sam Sony ...

If you can spare half an hour, then we guarantee success at your next VLSI interview. Do you want to secure at least 3 to 4 job offers by succeeding at all the phone and on-site Job interviews for this position? Or you simply want answer to most frequently asked interview questions in digital VLSI design?Did you know that people who made targeted question answer preparation for job interview are 4 ... En savoir plus

$13.73 CAD

If you can spare half an hour, then we guarantee success at your next VLSI interview. Do you want to secure at least 3 to 4 job offers by succeeding at all the phone and on-site Job interviews for this position? Or you simply want answer to most frequently asked interview questions in digital VLSI design?Did you know that people who made targeted question answer preparation for job interview are 4
... En savoir plus
Exploring Memory Hierarchy Design with Emerging Memory Technologies

par Guangyu Sun ...

Collections series Engineering (R0)
This book equips readers with tools for computer architecture of high performance, low power, and high reliability memory hierarchy in computer systems based on emerging memory technologies, such as STTRAM, PCM, FBDRAM, etc. The techniques described offer advantages of high density, near-zero static power, and immunity to soft errors, which have the potential of overcoming the “memory wall.” The ... En savoir plus

$115.29 CAD

This book equips readers with tools for computer architecture of high performance, low power, and high reliability memory hierarchy in computer systems based on emerging memory technologies, such as STTRAM, PCM, FBDRAM, etc. The techniques described offer advantages of high density, near-zero static power, and immunity to soft errors, which have the potential of overcoming the “memory wall.” The
... En savoir plus
Trace-Based Post-Silicon Validation for VLSI Circuits

par Xiao Liu, Qiang Xu ...

Collections series Engineering (R0)
This book first provides a comprehensive coverage of state-of-the-art validation solutions based on real-time signal tracing to guarantee the correctness of VLSI circuits. The authors discuss several key challenges in post-silicon validation and provide automated solutions that are systematic and cost-effective. A series of automatic tracing solutions and innovative design for debug (DfD) ... En savoir plus

$115.29 CAD

This book first provides a comprehensive coverage of state-of-the-art validation solutions based on real-time signal tracing to guarantee the correctness of VLSI circuits. The authors discuss several key challenges in post-silicon validation and provide automated solutions that are systematic and cost-effective. A series of automatic tracing solutions and innovative design for debug (DfD)
... En savoir plus
The Boundary-Scan Handbook

par Kenneth P. Parker ...

Collections series Engineering (R0)
Aimed at electronics industry professionals, this 4th edition of the Boundary Scan Handbook describes recent changes to the IEEE1149.1 Standard Test Access Port and Boundary-Scan Architecture. This updated edition features new chapters on the possible effects of the changes on the work of the practicing test engineers and the new 1149.8.1 standard. Anyone needing to understand the basics of ... En savoir plus

$166.99 CAD

Aimed at electronics industry professionals, this 4th edition of the Boundary Scan Handbook describes recent changes to the IEEE1149.1 Standard Test Access Port and Boundary-Scan Architecture. This updated edition features new chapters on the possible effects of the changes on the work of the practicing test engineers and the new 1149.8.1 standard. Anyone needing to understand the basics of
... En savoir plus
Semiconductor Technologies in the Era of Electronics

par Yong Hoon Kang ...

Collections series Engineering (R0)
Technological advances in the field of materials, devices, circuits, and systems began by the discovery of new properties of objects, or the entrepreneurship with the applications of unique or practical concepts for commercial goods. To implement products using these findings and challenges textbook knowledge is usually sufficient. Semiconductor Technologies in the Era of Electronics therefore ... En savoir plus

$115.99 CAD

Technological advances in the field of materials, devices, circuits, and systems began by the discovery of new properties of objects, or the entrepreneurship with the applications of unique or practical concepts for commercial goods. To implement products using these findings and challenges textbook knowledge is usually sufficient. Semiconductor Technologies in the Era of Electronics therefore
... En savoir plus
Regular Nanofabrics in Emerging Technologies

Design and Fabrication Methods for Nanoscale Digital Circuits

par M. Haykel Ben Jamaa ...

Collections series Engineering (R0)
Regular Nanofabrics in Emerging Technologies gives a deep insight into both fabrication and design aspects of emerging semiconductor technologies, that represent potential candidates for the post-CMOS era. Its approach is unique, across different fields, and it offers a synergetic view for a public of different communities ranging from technologists, to circuit designers, and computer scientists. ... En savoir plus

$179.99 CAD

Regular Nanofabrics in Emerging Technologies gives a deep insight into both fabrication and design aspects of emerging semiconductor technologies, that represent potential candidates for the post-CMOS era. Its approach is unique, across different fields, and it offers a synergetic view for a public of different communities ranging from technologists, to circuit designers, and computer scientists.
... En savoir plus
Research on the Radiation Effects and Compact Model of SiGe HBT

par Yabin Sun ...

Collections series Engineering (R0)
This book primarily focuses on the radiation effects and compact model of silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs). It introduces the small-signal equivalent circuit of SiGe HBTs including the distributed effects, and proposes a novel direct analytical extraction technique based on non-linear rational function fitting. It also presents the total dose effects irradiated by ... En savoir plus

$115.99 CAD

This book primarily focuses on the radiation effects and compact model of silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs). It introduces the small-signal equivalent circuit of SiGe HBTs including the distributed effects, and proposes a novel direct analytical extraction technique based on non-linear rational function fitting. It also presents the total dose effects irradiated by
... En savoir plus
CMOS Test and Evaluation

A Physical Perspective

par Manjul Bhushan, Mark B. Ketchen ...

Collections series Engineering (R0)
CMOS Test and Evaluation: A Physical Perspective is a single source for an integrated view of test and data analysis methodology for CMOS products, covering circuit sensitivities to MOSFET characteristics, impact of silicon technology process variability, applications of embedded test structures and sensors, product yield, and reliability over the lifetime of the product. This book also covers ... En savoir plus

$153.99 CAD

CMOS Test and Evaluation: A Physical Perspective is a single source for an integrated view of test and data analysis methodology for CMOS products, covering circuit sensitivities to MOSFET characteristics, impact of silicon technology process variability, applications of embedded test structures and sensors, product yield, and reliability over the lifetime of the product. This book also covers
... En savoir plus
Advanced Materials

Techniques, Physics, Mechanics and Applications

Modifié par Ivan A. Parinov, Shun-Hsyung Chang, Muaffaq A. Jani ...

Collections series Springer Nature Proceedings excluding Computer Science
This book presents 50 selected peer-reviewed reports from the 2016 International Conference on “Physics and Mechanics of New Materials and Their Applications”, PHENMA 2016 (Surabaya, Indonesia, 19–22 July, 2016). The Proceedings are devoted to processing techniques, physics, mechanics, and applications of advanced materials. As such, they examine a wide spectrum of nanostructures, ferroelectric ... En savoir plus

$370.99 CAD

This book presents 50 selected peer-reviewed reports from the 2016 International Conference on “Physics and Mechanics of New Materials and Their Applications”, PHENMA 2016 (Surabaya, Indonesia, 19–22 July, 2016). The Proceedings are devoted to processing techniques, physics, mechanics, and applications of advanced materials. As such, they examine a wide spectrum of nanostructures, ferroelectric
... En savoir plus
Microwave Electronics

par Andrey D. Grigoriev, Vyacheslav A. Ivanov, Sergey I. Molokovsky ...

Collections series Engineering (R0)
This book describes the physical basis of microwave electronics and related topics, such as microwave vacuum and microwave semiconductor devices.It comprehensively discusses the main types of microwave vacuum and microwave semiconductor devices, their principles of action, theory, parameters and characteristics, as well as ways of increasing the frequency limit of various devices up to the ... En savoir plus

$140.99 CAD

This book describes the physical basis of microwave electronics and related topics, such as microwave vacuum and microwave semiconductor devices.It comprehensively discusses the main types of microwave vacuum and microwave semiconductor devices, their principles of action, theory, parameters and characteristics, as well as ways of increasing the frequency limit of various devices up to the
... En savoir plus
Advanced Materials for Integrated Optical Waveguides

par Xingcun Colin Tong Ph.D ...

Collections series Physics and Astronomy (R0)
This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has ... En savoir plus

$179.99 CAD

This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has
... En savoir plus

Kobo Rakuten

Liseuses

Applis

Accessoires

Qu'est ce que les Kobo Super Points ?

Faites-vous plaisir

Panier

Vous profitez des avantages réservés aux VIP !

Votre panier est vide

Disponible:

1 livre audio par mois

+ Essai GRATUIT de 30 jours

Disponible:

1 livre audio par mois

+ Essai GRATUIT de 30 jours

Recommandé pour vous

Meilleures séries dans ce pays : Canada

Engineering (R0)

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Les lecteurs de ce roman ont aussi aimé

VLSI Interview Questions with Answers

Exploring Memory Hierarchy Design with Emerging Memory Technologies

Trace-Based Post-Silicon Validation for VLSI Circuits

The Boundary-Scan Handbook

Semiconductor Technologies in the Era of Electronics

Regular Nanofabrics in Emerging Technologies

Research on the Radiation Effects and Compact Model of SiGe HBT

CMOS Test and Evaluation

Advanced Materials

Microwave Electronics

Advanced Materials for Integrated Optical Waveguides

Liseuses

Applis

Accessoires

Panier

Vous profitez des avantages réservés aux VIP !

Votre panier est vide

Disponible:

1 livre audio par mois

+ Essai GRATUIT de 30 jours

Disponible:

1 livre audio par mois

+ Essai GRATUIT de 30 jours

Recommandé pour vous

Meilleures séries dans ce pays : Canada

Engineering (R0)

Afficher :

Les lecteurs de ce roman ont aussi aimé