Skip to main content
Search Button
Librairie Kobo Canada Cartes cadeau Aide

Kobo Rakuten

Ma liste d'envies

Panier

Vous profitez des avantages réservés aux VIP !

Article(s) non disponible(s) à la vente
Veuillez vérifier votre panier. Vous pouvez supprimer le ou les articles qui ne sont pas disponibles maintenant ou nous les supprimerons automatiquement au moment du règlement de la commande.
articlesarticle
articlesarticle

Recommandé pour vous

Loading...


1-12 sur 12 résultats pour « xuejun fan »
Skip side bar filters

  • Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

    par John Lau, Xuejun Fan ...
    Collections series Engineering (R0)
    The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates ... En savoir plus

    $217.99 CAD

  • Solid State Lighting Reliability Part 2

    Components to Systems

    Modifié par Xuejun Fan, Willem Dirk van Driel, Guo Qi Zhang ...
    Collections Livre 2 - Engineering (R0)
    In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, ... En savoir plus

    $267.69 CAD

Les lecteurs de ces romans ont aussi aimé

  • Semiconductor Manufacturing Handbook, Second Edition

    par Hwaiyu Geng ...
    Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations InformationWritten by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second ... En savoir plus

    $137.49 CAD

  • Small Antennas:Miniaturization Techniques & Applications

    par John Volakis, Chi-Chih Chen, Kyohei Fujimoto ...
    Next-generation small antenna design techniquesThis authoritative text provides the most up-to-date methods on the theory and design of small antennas, including an extensive survey of small antenna literature published over the past several years. Written by experts at the forefront of antenna research, Small Antennas: Miniaturization Techniques & Applications begins with a detailed presentation ... En savoir plus

    $111.99 CAD

  • 3D IC Integration and Packaging

    par John H. Lau ...
    A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system ... En savoir plus

    $227.99 CAD

  • 3d Printing And Additive Manufacturing Of Electronics: Principles And Applications

    par Chee Kai Chua, Wai Yee Yeong, Hong Yee Low, Tuan Tran, Hong Wei Tan ...
    Collections Livre 3 - World Scientific Series In 3d Printing
    3D printed electronics have captured much attention in recent years, owing to their success in allowing on-demand fabrication of highly-customisable electronics on a wide variety of substrates and conformal surfaces. This textbook helps readers understand and gain valuable insights into 3D printed electronics. It does not require readers to have any prior knowledge on the subject.3D Printing and ... En savoir plus

    $50.99 CAD

  • Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

    par John H. Lau ...
    Collections series Engineering (R0)
    This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, ... En savoir plus

    $217.99 CAD

  • LED Packaging for Lighting Applications

    Design, Manufacturing, and Testing

    par Xiaobing Luo, Shen Liu ...
    Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high ... En savoir plus

    $169.99 CAD

  • Flat Panel Display Manufacturing

    Modifié par Jun Souk, Fang-Chen Luo, Shinji Morozumi, Ion Bita ...
    Collections series Wiley Series in Display Technology
    An extensive introduction to the engineering and manufacture of current and next-generation flat panel displaysThis book provides a broad overview of the manufacturing of flat panel displays, with a particular emphasis on the display systems at the forefront of the current mobile device revolution. It is structured to cover a broad spectrum of topics within the unifying theme of display systems ... En savoir plus

    $185.99 CAD

  • Noise Coupling in System-on-Chip

    Modifié par Thomas Noulis ...
    Collections series Devices, Circuits, and Systems
    Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can ... En savoir plus

    $322.92 CAD

  • 3D IC Stacking Technology

    par Banqiu Wu, Sesh Ramaswami, Ajay Kumar ...
    The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry ... En savoir plus

    $170.39 CAD

  • Plastic Optical Fiber Sensors

    Science, Technology and Applications

    Modifié par Marcelo M. Werneck, Regina Célia S. B. Allil ...
    Collections series Series in Fiber Optic Sensors
    Plastic Optical Fiber Sensors cover the fundamentals and applications of a new class of fiber sensors. With contributions from leading academics in the area, this book covers the theory of plastic optical fiber sensors or (POFs), as well as applications in oil, gas, biotechnology, and energy fields.Using multiple examples, the editors showcase the advantageous characteristics of POFs, such as ease ... En savoir plus

    $97.99 CAD