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Engineering (R0) Série de Livres électroniques

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  • Interconnect Reliability in Advanced Memory Device Packaging

    par Chong Leong, Gan, Chen-Yu, Huang ...
    Collections series Engineering (R0)
    This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of ... En savoir plus

    $256.99 CAD

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  • Semiconductor Manufacturing Handbook, Second Edition

    par Hwaiyu Geng ...
    Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations InformationWritten by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second ... En savoir plus

    $137.49 CAD

  • WIRE BONDING IN MICROELECTRONICS, 3/E

    par George Harman ...
    The Industry Standard Guide to Wire Bonding--Fully UpdatedThe definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and ... En savoir plus

    $117.79 CAD

  • LED Packaging for Lighting Applications

    Design, Manufacturing, and Testing

    par Xiaobing Luo, Shen Liu ...
    Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high ... En savoir plus

    $169.99 CAD

  • Semiconductor Manufacturing Handbook

    par Hwaiyu Geng ...
    This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. ... En savoir plus

    $171.99 CAD

  • 3d Printing And Additive Manufacturing Of Electronics: Principles And Applications

    par Chee Kai Chua, Wai Yee Yeong, Hong Yee Low, Tuan Tran, Hong Wei Tan ...
    Collections Livre 3 - World Scientific Series In 3d Printing
    3D printed electronics have captured much attention in recent years, owing to their success in allowing on-demand fabrication of highly-customisable electronics on a wide variety of substrates and conformal surfaces. This textbook helps readers understand and gain valuable insights into 3D printed electronics. It does not require readers to have any prior knowledge on the subject.3D Printing and ... En savoir plus

    $50.99 CAD

  • Flat Panel Display Manufacturing

    Modifié par Jun Souk, Fang-Chen Luo, Shinji Morozumi, Ion Bita ...
    Collections series Wiley Series in Display Technology
    An extensive introduction to the engineering and manufacture of current and next-generation flat panel displaysThis book provides a broad overview of the manufacturing of flat panel displays, with a particular emphasis on the display systems at the forefront of the current mobile device revolution. It is structured to cover a broad spectrum of topics within the unifying theme of display systems ... En savoir plus

    $185.99 CAD

  • Semiconductor Packaging

    Materials Interaction and Reliability

    par Andrea Chen, Randy Hsiao-Yu Lo ...
    In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a ... En savoir plus

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  • Nanoscale CMOS VLSI Circuits: Design for Manufacturability

    par Sandip Kundu, Aswin Sreedhar ...
    Cutting-Edge CMOS VLSI Design for Manufacturability TechniquesThis detailed guide offers proven methods for optimizing circuit designs to increase the yield, reliability, and manufacturability of products and mitigate defects and failure. Covering the latest devices, technologies, and processes, Nanoscale CMOS VLSI Circuits: Design for Manufacturability focuses on delivering higher performance and ... En savoir plus

    $138.99 CAD

  • Electrical and Electronic Devices, Circuits and Materials

    Design and Applications

    par Suman Lata Tripathi, Parvej Ahmad Alvi, Umashankar Subramaniam ...
    The increasing demand in home and industry for electronic devices has encouraged designers and researchers to investigate new devices and circuits using new materials that can perform several tasks efficiently with low IC (integrated circuit) area and low power consumption. Furthermore, the increasing demand for portable devices intensifies the search to design sensor elements, an efficient ... En savoir plus

    $107.99 CAD

  • 3D IC Integration and Packaging

    par John H. Lau ...
    A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system ... En savoir plus

    $227.99 CAD

  • Chemical Process Retrofitting and Revamping

    Techniques and Applications

    Modifié par Gade Pandu Rangaiah ...
    The proposed book will be divided into three parts. The chapters in Part I provide an overview of certain aspect of process retrofitting. The focus of Part II is on computational techniques for solving process retrofit problems. Finally, Part III addresses retrofit applications from diverse process industries.Some chapters in the book are contributed by practitioners whereas others are from ... En savoir plus

    $200.99 CAD